Blog

New innovation offers solution to AI overheating challenges

Illustration of a fiber membrane removing heat from an electronic chip through evaporation. Credit: Tianshi Feng

Engineers have developed a passive evaporative cooling membrane that dramatically improves heat removal for electronics and data centers

Engineers at the University of California San Diego have created an innovative cooling system designed to greatly enhance the energy efficiency of data centers and high-performance electronic devices. This new approach relies on a specially engineered fiber membrane that naturally removes heat through evaporation. It provides an effective and energy-saving alternative to conventional cooling methods such as fans, heat sinks, and liquid pumps, while also potentially reducing the large amounts of water used by many existing systems.

Read More

Click to rate this post!
[Total: 1 Average: 5]

Leave a Reply

Your email address will not be published. Required fields are marked *